英文大綱 |
1. INTRODUCTION TO THE SEMICONDUCTOR INDUSTRY •Describe a basic IC fabrication sequence •IC Device and Design •Semiconductor Manufacturing Processes •Future Trends 2. CHARACTERISTICS OF SEMICONDUCTOR MATERIALS •Semiconductor Substrate and Dopants •Band Gap and Resistivity •Crystal Structures: Amorphous, Polycrystalline, and Single crystal •Defects: Point defects, line defects, and plane defects
3. DEVICE TECHNOLOGY •Devices •Analog and digital•Memory chips
4. SILICON AND WAFER PREPARATION •Single crystal preparation •Wafer processing •Epitaxy Grow •Defects and inspection
5. CONTAMINATION CONTROL •Types of contamination •Contamination control
6. IC FABRICATION PROCESS FLOW
7. OXIDATION PROCESS •gate oxide processes •Oxidation mechanism
8. ION IMPLANT AND ANNEALING
9. THIN FILM DEPOSITION •PVD •CVD •Electroplating
10. PHOTOLITHOGRAPHY •Photoresists •Alignment and exposure systems •Resolution and depth of focus 11. ETCH PROCESS •Wet and dry etch processes 12. PLANARIZATION •CMP
13. LOW k TECHNOLOGY •Applications of dielectrics in IC •Preparation of low-k films
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